Jiangsu GIS Laser Technologies Inc.,

Jiangsu GIS Laser Technologies Inc.,

Manufacturer from China
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FPC HDI 50um Laser Direct Imaging Equipment 610x710mm

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Jiangsu GIS Laser Technologies Inc.,
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City:suzhou
Country/Region:china
Contact Person:MissTian
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FPC HDI 50um Laser Direct Imaging Equipment 610x710mm

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Brand Name :GIS
Model Number :DPX630SM
Certification :ISO 9001 CE
Place of Origin :Jiangsu, China
MOQ :1 set
Price :negotiable price
Supply Ability :30set per month
Delivery Time :20 work days
Packaging Details :wooden case packing
Name :laser Direct Imaging (LDI)
Application :PCB HDI FPC
Exposure Size Max :610*710mm
Line Width :50μm
Line Line Distance :50μm
Line Width tolerance :10%
Laser Type :LD Laser, 405±5nm
Deviation increase and decrease :Fixed increase and contracton, automatic increase and contraction, interval increase and contraction, partition alignment
File Format :Gerber 274X, ODB++
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laser direct imaging (LDI) system solutions PCB Solder Mask

Difference between LDI and traditional exposure

1. Traditional exposure is to transfer the image to PCB by irradiating the negative with a mercury lamp

2. LDI uses the laser scanning method to directly image the image on PCB, and the image is finer


PCB laser direct imaging (LDI)
When fabricating a circuit board, the circuit traces are defined by what is the imaging process. Laser direct imaging ( LDI ) exposes the traces directly with a highly focused laser beam that in NC controlled, instead of flooded light passing through a photo tool, a laser beam will digitally create the image.


How does laser direct imaging ( LDI ) work?
Laser direct imaging needs a PCB with the photo-sensitive surface that is positioned under a computer controlled laser. And then the computer is creating the image on the board with the light of laser. A computer scans the board surface into a raster image, matching the raster image to a pre-loaded CAD or CAM design file that includes the specifications for the necessary image intended for the board, the laser is used for directly creating the image on the board.

Specification/model DPX230
Application PCB,HDI,FPC (inner layer,outer layer,anti-welding)
Resolution (mass production) 30um
Capacity 30-40S@18"*24"
Exposure Size 610*710mm
Panel thickness 0.05mm-3.5mm
Alignment Mode UV-Mark
Alignment capability Outer layer±12um;Inner laye±24um
Line width tolerance ±10%
Deviation increase and decrease mode Fixed increase and contraction, automatic increase and contraction, interval increase and contraction, partition alignment
Laser type LD Laser,405±5nm
File format Gerber 274X;ODB++
Power 380V three-phase alternating current, 6.4kW,50HZ, voltage fluctuation range + 7% ~-10%
Condition Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above;
Vibration requirements to avoid violent vibration near the equipment


About us
We are an innovative supplier of various PCB laser direct imaging (LDI) system solutions. Our system product portfolio ranges from LDI system configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.

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