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laser direct imaging (LDI) system solutions HDI PCB
Compatible with existing processes and production methods. Batch production processes and methods are usually carefully specified to meet the requirements of batch production. The introduction of any new imaging method should minimize the change of existing methods. This includes the traceability function of minimizing the change of dry film used, the ability to expose each layer of solder resist film, and batch production requirements.
PCB laser direct imaging (LDI)
When fabricating a circuit board, the circuit traces are defined by what is the imaging process. Laser direct imaging ( LDI ) exposes the traces directly with a highly focused laser beam that in NC controlled, instead of flooded light passing through a photo tool, a laser beam will digitally create the image.
How does laser direct imaging ( LDI ) work?
Laser direct imaging needs a PCB with the photo-sensitive surface that is positioned under a computer controlled laser. And then the computer is creating the image on the board with the light of laser. A computer scans the board surface into a raster image, matching the raster image to a pre-loaded CAD or CAM design file that includes the specifications for the necessary image intended for the board, the laser is used for directly creating the image on the board.
Specification/model | DPX420TFA |
Application | PCB,HDI,FPC (inner layer,outer layer,anti-welding) |
Resolution (mass production) | 30um |
Capacity | 30-40S@18"*24" |
Exposure Size | 610*710mm |
Panel thickness | 0.05mm-3.5mm |
Alignment Mode | UV-Mark |
Alignment capability | Outer layer±12um;Inner laye±24um |
Line width tolerance | ±10% |
Deviation increase and decrease mode | Fixed increase and contraction, automatic increase and contraction, interval increase and contraction, partition alignment |
Laser type | LD Laser,405±5nm |
File format | Gerber 274X;ODB++ |
Power | 380V three-phase alternating current, 6.4kW,50HZ, voltage fluctuation range + 7% ~-10% |
Condition | Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above; Vibration requirements to avoid violent vibration near the equipment |
About us
We are an innovative supplier of various PCB laser direct imaging (LDI) system solutions. Our system product portfolio ranges from LDI system configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.