Jiangsu GIS Laser Technologies Inc.,
Jiangsu GIS Laser Technologies Inc.,
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The Laser Direct Imaging Machine (LDI Direct Imaging) is a laser imaging equipment used for the production of high-precision circuit boards. It is designed to offer the highest accuracy and reliability, with a technology raster of line width/line spacing of 25/25μm, and a highly sensitive dry film of 35s@24. Plus, the LDI Direct Imaging machine offers a range of scale modes, including Fixed Scale, Auto Scale, Interval Scale and Partition Alignment, as well as full table splicing exposure. It also supports text information to be set on the board, such as serial numbers and other traceable information. With its high-end technology and features, the Laser Direct Imaging Machine is the perfect tool for the production of high-precision circuit boards.
| Technical Parameters | Details |
|---|---|
| Text Information | Support The Board To Set Text And Serial Number And Other Traceable Information |
| Laser Power | 405 Nm/25-50 W(optional) |
| Inner Alignment Accuracy | 20μm |
| High Sensing Dry Film | 35s@24 |
| Applicable Process | Inner, Outer, Ceramic Substrate |
| Scale Mode | Fixed Scale/ Auto Scale/ Interval Scale/Partition Alignment |
| Technology Raster | Line Width/ Line Spacing 25/25μm |
| Splicing | Support Full Table Splicing Exposure |
| Application | PCB,HDI,FPC |
| Effective Exposure Area | 610mm*710mm |
GIS Laser's DPX230 LDI Print System is a reliable and efficient solution for PCB, HDI and FPC production. With an inner alignment accuracy of 20μm and outer alignment accuracy of ±10μm, this system delivers outstanding precision and accuracy. Moreover, its sensing dry film of 35s@24 makes it very efficient. Last but not least, it also supports the board to set text and serial number or other traceable information. With the LDI Print System, GIS Laser is the perfect choice for PCB, HDI and FPC production.
GIS Laser's DPX230 Laser Direct Imaging Machine is a reliable and accurate laser imaging equipment that can help you to quickly and easily complete the printing process. It is suitable for a variety of PCBs, including inner, outer, and ceramic substrates. It features full table splicing exposure, board thickness from 0.05mm to 7mm, effective exposure area of 610mm*710mm, and outer alignment accuracy of ±10μm.
Laser Direct Imaging Machine offers technical support and services for its products. These services include:
Packaging and Shipping Laser Direct Imaging Machine:
The Laser Direct Imaging Machine will be shipped in a single, large box with the following items:
The box will be securely sealed to prevent any damage or tampering during shipping. It will also be clearly labeled with the product name and the shipping address.